Large area filters offer long life and on-the-fly replacement. Cureflow™ Ovens are available with either a mesh belt or Edge Grabber™ conveyor. Access to the process cavity is available from either side of the assembly line via the patented hood lift while also allowing the same system to serve in either a Right to Left or Left to Right process direction.
#Reflow solder oven software
Cross-platform (Windows, Machintosh, Linux) Software provides an easy to learn and easy to use interface to control the solder reflow oven. The 1.75 inch throat opening (above and below the Edge Grabber ™ conveyor pass-line) accepts tall electronic assemblies. When an operator places an electronic product inside the device, it precisely applies surface mount components to the printed circuit board (PCB). These machines vary in size from small boxy ovens to inline- or conveyor-belt-style options. Air is cascaded from one zone to the next reducing energy consumption. A non-converted toaster oven will solder things, but it will not follow the manufacturer-recommended reflow profile for a device, so you may risk dead parts or. A SMT reflow oven is an essential machine of the thermal processing of solder for electronics manufacturing. Columnized air retains its direction and velocity resulting in maximum impingement velocity on the product, high energy transfer and Near Equilibrium Heating™. Also, with judicious solder ball placement, reflow soldering is actually capable of very. The air is heated and forced through nozzles onto the product. A reflow oven can produce a lot more units in a shorter period of time.
#Reflow solder oven full
Recycled and Cascaded air is drawn from the low thermal mass process cavity with tangential blower wheels running the full width of the process cavity for even airflow. Low mass coil heating elements provide quick response for varying production loads ensuring process repeatability.
Infra-red “boosters” provide quick temperature acceleration to high thermal mass components or ground planes while Recirculating Hot Air (RHA) blowers maintain even temperature to all areas of the assembly. Utilizing existing technologies from other ETS Factory Automation, Material Handling Conveyors and Thermal Ovens, Cureflow™ optimizes thermal energy transfer to electronic assemblies through its unique combination of Convection and Infra-red heat delivery systems. SMT Reflow Ovens for Solder Reflow and Adhesive Curing: Cureflow™ is a flexible family of products designed for Lead or Lead Free Solder Reflow, adhesive curing and other Surface Mount Technology (SMT) heating and thermal processing requirements.
Solder Reflow and Adhesive Curing Oven Cureflow ™
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